规格书 |
4-1542008-3 Drawing |
文档 |
4-1542008-3 Statement of Compliance RoHS 2 Statement |
Rohs | Lead free / RoHS Compliant |
RoHS信息 | 4-1542008-3 Statement of Compliance |
标准包装 | 250 |
类型 | Passive |
冷却装置 | BGA |
固定方法 | Clip |
产品高度 | 12.7 mm |
散热片样式 | Pin Array |
表面处理 | Black Anodized |
材质 | Cold-Forged Aluminum |
标准包装 | Trays |
RoHS | RoHS Compliant |
工厂包装数量 | 50 |
评论 | Mounting clip does not increase overall heat sink height.; Heat sink assembly i |
RoHSELV合规性 | RoHS compliant, ELV compliant |
Lead Free Solder Processes | Not relevant for lead free process |
高(毫米( ) ) | 12.70 [0.500] |
直径(毫米( ) ) | 34.95 [1.376] |
包装尺寸(毫米( ) ) | 35 [1.379] |
设备类型 | BGA |
可燃性等级 | UL 94V-0 |
风扇类型 | No Fan |
散热器类型 | Pin Fin 1 |
适用于 | BGA Semiconductor Packages |
行 | ChipCoolers |
产品类型 | Heat Sink |
RoHSELV符合记录 | Always was RoHS compliant |
子类别 | Heat Sink |
交货期 | 63 Days |
系列 | * |
RoHS指令 | Lead free / RoHS Compliant |
标准包装 | 25 |
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